发明名称 SECTION PROCESSING METHOD, SECTION PROCESSING APPARATUS
摘要 Provided are a method and an apparatus for processing a cross section, which can form the flat cross section by a focused ion beam to samples made of materials having different hardness. Based on cross section information on SEM obtained by observation of the cross section, irradiation interval and irradiation time of the focused ion beam is variably controlled, and an etching process of a processing area is performed. Accordingly, even if the samples consist of materials having different hardness, a flat observational surface can be formed by a uniform etching rate.
申请公布号 KR20150047427(A) 申请公布日期 2015.05.04
申请号 KR20140141720 申请日期 2014.10.20
申请人 HITACHI HIGH-TECH SCIENCE CORPORATION 发明人 SUZUKI HIDEKAZU;ASAHATA TATSUYA;UEMOTO ATSUSHI
分类号 G01N1/28;H01J37/30;H01L21/66 主分类号 G01N1/28
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