THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT

摘要

The present invention provides a thermosetting resin composition and a cured product which are compatible with excellent heat resistance and the flame retardancy when curing the same. The present invention a thermosetting resin composition containing a phenol resin (A) and an epoxy resin (B) obtained by reaction of a dimethylol body (A-1) of a nitrogen-containing compound with a phenolic hydroxyl group-containing compound (A-2) which contains two or more phenolic hydroxyl groups within one molecule and has a hydroxyl group equivalent weight of equal to or greater than 100 g/eq.