| 摘要 |
The purpose of the present invention is to provide a printed circuit board capable of enhancing bending strength thereof wherein a copper foil layer stacked on an insulating layer is configured alternatively along the longitudinal direction. The present invention relates to a printed circuit board where a structure of dummy part is improved so as to improve bending strength of the printed circuit board wherein a plurality of insulating layers formed of a copper layer is build up and wherein a product zone and a dummy zone are arranged respectively along a center portion and a boundary portion of the insulating layers. In the dummy zone, copper layers configured on each insulating layer may be arranged along the longitudinal direction at regular intervals. |
