发明名称 半導体装置の作製方法
摘要 <p>A highly responsive semiconductor device in which the subthreshold swing (S value) is small and reduction in on-current is suppressed is manufactured. A semiconductor layer in which a thickness of a source region or a drain region is larger than that of a channel formation region is formed. A semiconductor layer having a concavo-convex shape which is included in the semiconductor device is formed by the steps of forming a first semiconductor layer over a substrate; forming a first insulating layer and a conductive layer over the first semiconductor layer; forming a second insulating layer over a side surface of the conductive layer; forming a second semiconductor layer over the first insulating layer, the conductive layer and the second insulating layer; etching the second semiconductor layer using a resist formed partially as a mask; and performing heat treatment to the first semiconductor layer and the second semiconductor layer.</p>
申请公布号 JP5726341(B2) 申请公布日期 2015.05.27
申请号 JP20140005841 申请日期 2014.01.16
申请人 发明人
分类号 H01L21/336;H01L21/20;H01L29/786 主分类号 H01L21/336
代理机构 代理人
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