| 摘要 |
PROBLEM TO BE SOLVED: To suppress peel-out of a film base material and a semiconductor film and peel-out of the film base material and an encapsulation material even in a case where a flexural stress caused by curved surface installation is generated, by releasing the flexural stress acting on the film.SOLUTION: A film device comprises: a semiconductor electrode 5 formed by depositing a transparent electrode and a semiconductor layer in this order by using a first substrate 2 as a base; a counter electrode 6 formed by depositing a transparent electrode by using a second base material 3 as a base; and an electrolyte encapsulated between the semiconductor electrode 5 and the counter electrode 6 by an encapsulation material or a local heating step. A slit 7 consisting of a continuous line is formed at a non-deposition part of at least one of the first substrate 2 and the second substrate 3. |
