PLATING PROCESS, AND ELECTRONIC PART MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide: a plating process capable of sufficiently plating not only the upper face of an object to be plated but also the side faces of the object to be plated when plating forms a metal film on the object to be plated using a plating protective sheet made of an ultraviolet curable adhesive sheet; and an electronic part manufacturing method using such a plating process.SOLUTION: Provided is a process for plating an object to be plated having a face not to be plated. The process comprises: adhering an adhesive layer of an ultraviolet curable adhesive sheet to the face not to be plated of the object to be plated; curing the adhesive layer of the ultraviolet curable adhesive sheet to which the object to be plated is not adhered; and plating the object to be plated.