| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a double-faced adhesive film which can maintain sufficient adhesive force even after it is heated to a high temperature and immersed in a solvent when it is used in the adhesion of a substrate with an element such as the semiconductor element. <P>SOLUTION: The double-faced adhesive film 1 includes a supporting film 10 and adhesive layers 21,22 laminated on both surfaces of the supporting film 10, respectively. The adhesive layers 21,22 are formed by a method including a process comprising directly applying a varnish onto the supporting film 10 and drying the applied varnish. The flow amount of each adhesive layer 21,22 is 0-2,000μm, and the adhesive layers 21,22 each has a glass transition temperature of≤100°C after curing. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
