| 摘要 |
<p>The arrangement (1) comprises a transportation packaging (2) provided with a planar sheet (10), a covering film (30), and a drip-tray type plastic structure (80). The plastic structure partly encloses the power semiconductor module (5). The side of power semiconductor module directly or indirectly rests on the major surface of the planar sheet. The farthest sides of power semiconductor module are covered by the covering film.</p> |
