| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a line formation method capable of providing a thickness-uniform line, by providing a value thick in a thickness of a line, that is, higher than usual (a thickness of a line/a width of the line), even in a fine line, when forming a pattern of an insulation coating film on a substrate by an inkjet method.SOLUTION: The line formation method is provided for forming a line by coating by wet-on-wet coating an activation energy line curable resin composition on the substrate by the inkjet method of using a piezo type inkjet device. The line formation method is provided for wet-on-wet coating by moving by a shorter distance than an impact diameter in the line formation direction for (n+1) time coating to the impact diameter of the activation energy line curable resin composition coated at a predetermined impact pitch in the (n)th time.</p> |
