| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To perform processing so that the processed groove width and depth to a workpiece are uniform, when processing the workpiece such as a circuit board by laser beams. <P>SOLUTION: In the laser processing method for processing the groove by using a pulsed laser and a galvano-scanner, pulse height of the laser beams is increased/decreased in synchronization with beam scan speed by the galvano-scanner. Thus, the processed groove width and depth of the workpiece by the laser beams can be made uniform, so as to improve processing quality to the workpiece. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
