| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laser machining device that can stably support a substrate while maintaining the flatness of the substrate even if the substrate has a thin thickness. <P>SOLUTION: The laser machining device 100 includes: a contact support 3 provided on a base 1 and formed by a free ball bearing that supports a workpiece 9 by abutting on a lower surface of the workpiece; a pneumatic levitation parts 2a, 2b for spraying air to the workpiece 9 to reduce the warpage of the workpiece 9; a laser beam radiation device; and a machining feed device 7 for conveying the workpiece 9 in an x direction. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
