MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

In a manufacturing method of a semiconductor device of an embodiment, a plurality of semiconductor packages, as objects to be processed, each including a semiconductor chip mounted on a wiring board and a sealing resin layer, and a tray including a plurality of housing parts are prepared. The semiconductor packages are respectively disposed in the plurality of housing parts of the tray. A metal material is sputtered on the semiconductor packages disposed in the housing parts, to thereby form a conductive shield layer covering an upper surface and side surfaces of each of the sealing resin layers and at least a part of side surfaces of each of the wiring boards.

主权项

1. A manufacturing method of a semiconductor device, comprising:
preparing a plurality of objects to be processed each having a wiring board, a semiconductor chip mounted on the wiring board, and a sealing resin layer sealing the semiconductor chip; preparing a tray having a plurality of housing parts; disposing, in each of the plurality of housing parts of the tray, the object so that an upper surface and side surfaces of the sealing resin layer and at least a part of side surfaces of the wiring board when a surface of the wiring board on which the semiconductor chip is mounted is defined as an upper side are exposed; and forming a conductive shield layer which covers the upper surface and the side surfaces of the sealing resin layer and at least a part of the side surfaces of the wiring board, by sputtering a metal material on the object disposed in each of the housing parts of the tray.