ELECTROPLATED SOLDER FOR HIGH-TEMPERATURE INTERCONNECT

摘要

This chip package includes a substrate having a multilayer electroplated stack disposed on a surface of the substrate. The multilayer electroplated stack may include one or more instances of alternating layers of gold and tin, where relative thicknesses of the alternating layers, when melted, result in a chemical composition having an initial melting temperature to form a bump and a subsequent melting temperature to reflow the bump that is higher than the initial melting temperature. For example, the chemical composition may correspond to a non-equilibrium gold-tin alloy.

主权项

1. A chip package, comprising:
a substrate having a surface; and a multilayer electroplated stack, disposed on the surface, with one or more instances of alternating layers of gold and tin, wherein relative thicknesses of the alternating layers, when melted, result in a chemical composition having an initial melting temperature to form a bump and a subsequent melting temperature to reflow the bump that is higher than the initial melting temperature, wherein the chip package further includes a bond pad disposed on the surface and the multilayer electroplated stack is disposed on the bond pad, and wherein the chip package further includes a multilayer stack of nickel and gold disposed between the bond pad and the multilayer electroplated stack.