| 发明名称 |
SEMICONDUCTOR CHIP AND ELECTRONIC SYSTEM INCLUDING THE SAME |
| 摘要 |
A semiconductor chip includes a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate. The circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction. The thermoelectric layer includes a first on-die thermoelectric element, where the thermoelectric layer is disposed on the circuit layer including the first circuit and the second circuit. The first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit. |
| 申请公布号 |
US2015170992(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414565525 |
申请日期 |
2014.12.10 |
| 申请人 |
Yang Jun-Hyeok;Kim Se-Ki;An Se-Ra;Ko Hyung-Jong |
发明人 |
Yang Jun-Hyeok;Kim Se-Ki;An Se-Ra;Ko Hyung-Jong |
| 分类号 |
H01L23/38;H01L27/16;H01L25/18;H01L23/34 |
主分类号 |
H01L23/38 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor chip comprising: a semiconductor circuit layer and a semiconductor thermoelectric layer disposed on a substrate, the circuit layer includes a first circuit and a second circuit disposed horizontally in a first direction, the thermoelectric layer includes a first on-die thermoelectric element, wherein the thermoelectric layer is disposed above the circuit layer including the first circuit and the second circuit, and the first on-die thermoelectric element is configured to distribute heat generated at the first circuit horizontally in the first direction toward the second circuit. |
| 地址 |
Seongnam-si KR |
