发明名称 LASER CUT-OFF PROCESSING METHOD AND LASER CUT-OFF PROCESSING SEQUENCE SETTER
摘要 PROBLEM TO BE SOLVED: To provide a laser cut-off processing method that enables cut and separation of each cut piece arranged in a plurality of lines and a plurality of rows with no interference of scraps with a laser processing head even when the scraps incline to cause a part to project out of the top face of a work-piece. ! SOLUTION: When a longitudinal common cutting line between each row and a lateral common cutting line between each cut piece in each row are to be processed by laser cutting, the presence of a scrap enables laser cut-off processing in a direction where a work-piece keeps away from the scrap when the scrap is cut and separated from the work-piece without such a laser cut-off processing as to turn round this scrap continuously. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015116604(A) 申请公布日期 2015.06.25
申请号 JP20130263472 申请日期 2013.12.20
申请人 AMADA HOLDINGS CO LTD 发明人 MASUDA KENJI
分类号 B23K26/38;B23K26/00 主分类号 B23K26/38
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