THICK FILM CIRCUITS WITH CONDUCTIVE COMPONENTS FORMED USING DIFFERENT CONDUCTIVE ELEMENTS AND RELATED METHODS

摘要

Disclosed herein are a variety of embodiments of thick film circuits with conductive components formed using different conductive elements and related methods for forming such circuits. One embodiment consistent with the present disclosure includes a multi-level thick film circuit formed on a substrate and having a first layer disposed on the substrate. The first layer may include a first conductive component formed using a first conductive element. The first conductive element may be a precious metal. The circuit may further include a second layer having a second conductive component. The second conductive component may be formed using a second conductive element. In one embodiment, the second conductive element may be a base metal. At least a portion of the first conductive element may directly contact at least a portion of the second conductive element such that the first layer is in electrical communication with the second layer.

主权项

1. A multi-level thick film circuit, comprising:
a substrate; a first layer disposed on the substrate, the first layer comprising a first conductive component formed using a first conductive element, the first conductive element comprising a precious metal; a second layer comprising a second conductive component formed using a second conductive element, the second conductive element comprising a base metal; and wherein at least a portion of the first conductive component directly contacts at least a portion of the second conductive component such that the first conductive component is in electrical communication with the second conductive component.