| 发明名称 |
SEMICONDUCTOR PACKAGE MODULE |
| 摘要 |
There is provided a semiconductor package module including: a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other. |
| 申请公布号 |
US2015181708(A1) |
申请公布日期 |
2015.06.25 |
| 申请号 |
US201414268156 |
申请日期 |
2014.05.02 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Ryu Jong In;Jo Eun Jung;Yoo Do Jae |
| 分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package module comprising:
a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other. |
| 地址 |
Suwon-Si KR |
