发明名称 SUSPENSION BOARD ASSEMBLY SHEET WITH CIRCUITS AND MANUFACTURING METHOD OF THE SAME
摘要 A plurality of suspension boards are integrally supported by a support frame. A plurality of inspection substrates are provided to correspond to the plurality of suspension boards. In each suspension board, lines are formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the line are electrically connected by a via in the base insulating layer. In each inspection substrate, a conductor layer is formed on a conductive support substrate with a base insulating layer sandwiched therebetween. The support substrate and the conductor layer are electrically connected by a via in the base insulating layer.
申请公布号 US2015181695(A1) 申请公布日期 2015.06.25
申请号 US201414565552 申请日期 2014.12.10
申请人 Nitto Denko Corporation 发明人 ICHINOSE Kouji;IHARA Terukazu
分类号 H05K1/02;H05K3/10;H05K3/40;H05K1/14;H05K1/11 主分类号 H05K1/02
代理机构 代理人
主权项 1. A suspension board assembly sheet with circuits comprising: a plurality of suspension boards with circuits; a support frame that integrally supports the plurality of suspension boards with circuits; and a plurality of inspection substrates provided to correspond to the plurality of suspension boards with circuits, wherein each of the plurality of suspension boards with circuits includes a conductive first support substrate, a first insulating layer formed on the first support substrate, a conductor line formed on the first insulating layer, and a first via that passes through the first insulating layer and electrically connects the first support substrate and the conductor line, each of the plurality of inspection substrates includes a conductive second support substrate, a second insulating layer formed on the second support substrate, a conductor layer formed on the second insulating layer and a second via that passes through the second insulating layer and electrically connects the second support substrate and the conductor layer, and the first via and the second via have the same configuration.
地址 Osaka JP