| 摘要 |
PROBLEM TO BE SOLVED: To improve an overlay error in exposure processing by appropriately performing measurement of the overlay error.SOLUTION: A coating development system 1 for processing a wafer W comprises: a processing station 11 in which a plurality of processing apparatuses for processing the wafer W are provided; an interface station 12 for delivering the wafer W with an exposure device 13 including a plurality of exposure stages 13a, 13b; a plurality of wafer inspection devices 71, 72 for performing inspection of a surface of the wafer W; wafer transfer mechanisms 70, 80 for transferring the wafer W between each processing device in the processing station 11 and the wafer inspection devices 71, 72; and a control part 300 for identifying an exposure stage used in exposure processing of the wafer W transferred from the exposure device 13 from among the exposure stages 13a, 13b and controlling the wafer transfer mechanisms 70, 80 to transfer the wafer W after the exposure processing to a wafer inspection device preliminarily associated to the specified exposure stage. |
