METHOD AND APPARATUS FOR CLEANING OF THREE DIMENSIONAL WAFER SURFACE

摘要

Disclosed is a three-dimensional wafer surface cleaning device to remove foreign substances on a three-dimensional wafer surface, wherein a three-dimensional structure is formed on the surface. The three-dimensional wafer surface cleaning device comprises: a wafer supporting unit to support a three-dimensional wafer; and a dry ice injecting unit to inject solid CO_2 dry ice to the three-dimensional wafer surface through a cleaning nozzle by producing the solid CO_2 dry ice through the adiabatic expansion of liquid CO_2 in the cleaning nozzle or around the same. The CO_2 dry ice injecting unit comprises: a CO_2 supply unit to supply the liquid CO_2 to the cleaning nozzle; and an acceleration clean air supply unit to supply clean air to the cleaning nozzle.