Method of reducing solder wicking on a substrate

摘要

This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.

主权项

1. A method of reducing solder wicking on a substrate when connecting a surface mount component to a plated via and conductive pad structure connected to conductive layers of the substrate, comprising:
placing the surface mount component on the plated conductive pad, wherein the surface mount component includes a package having an upper surface with solderable terminal sides and a terminal end; surrounding the plated via with a solder mask; exposing a part of the conductive pad that extends beyond each of the solderable terminal sides of the surface mount component to increase solder formation between the conductive pad and the solderable terminal sides; and covering with a solder mask the part of the conductive pad that extends beyond the solderable terminal end to reduce solder formation at the terminal end of the surface mount component and to reduce solder formation at the plated via.