| 摘要 |
<p>The present invention relates to a method for manufacturing a semiconductor package substrate, having a simple process and solving an upper and lower pattern alignment problem, and to the semiconductor package substrate using the same, and more specifically, to a method for manufacturing a semiconductor package substrate, comprising the steps of: forming a groove or a trench on one surface of a base substrate of a conductive material; filling the groove or the trench with a resin; and etching the other surface of the base substrate so that the resin filling the groove or the trench is exposed, and to the semiconductor package substrate using the same.</p> |
