Adhesive wafer bonding with controlled thickness variation

摘要

A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.

主权项

1. A structure comprising:
a stabilization layer including an array of stabilization posts; an array of micro devices formed over the array of stabilization posts; and a carrier substrate including raised spacers extending from a spacer-side surface of the carrier substrate, wherein the raised spacers extend into the stabilization layer to meet a subset of the stabilization posts in the array of stabilization posts.