| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To fix as much as possible the time interval of irradiations of the laser beam emitted from a laser beam irradiation portion and, by extension, perform uniform processing. <P>SOLUTION: A laser beam machining system includes: a holding portion 20 for holding an object-to-be-processed 60; a laser irradiation portion 10 having a laser oscillating portion 11 for irradiating a laser beam L formed of CW laser and a switch portion 12 for forming a pulse-like laser beam L by intercepting the laser beam L emitted from the laser beam oscillating portion 11; and a moving portion 30 for moving at least one of the holding portion 20 and the laser irradiation portion 10, relatively to the other. The laser beam machining system is also provided with: a memory portion 52 which memorizes positional information of a plurality of spots 60a intended for processing; a selecting portion 51 which suitably selects the spot 60a intended for processing to be processed next time according to positional information of the spots 60a intended for processing memorized in the memory portion 52; and a controlling portion 50 which controls the moving portion 30 so as to process the spot 60a intended for processing, selected by the selecting portion 51. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
