发明名称 |
Enhanced EUV lithography system |
摘要 |
The present disclosure provides a semiconductor lithography system. The lithography system includes a projection optics component. The projection optics component includes a curved aperture. The lithography system includes a photo mask positioned over the projection optics component. The photo mask contains a plurality of elongate semiconductor patterns. The semiconductor patterns each point in a direction substantially perpendicular to the curved aperture of the projection optics component. The present disclosure also provides a method. The method includes receiving a design layout for a semiconductor device. The design layout contains a plurality of semiconductor patterns each oriented in a given direction. The method includes transforming the design layout into a mask layout. The semiconductor patterns in the mask layout are oriented in a plurality of different directions as a function of their respective location. |
申请公布号 |
US9091930(B2) |
申请公布日期 |
2015.07.28 |
申请号 |
US201213437145 |
申请日期 |
2012.04.02 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chang Ching-Hsu;Cheng Nian-Fuh;Chou Chih-Shiang;Huang Wen-Chun;Liu Ru-Gun |
分类号 |
G03F1/22;G03F1/70;G03F7/20 |
主分类号 |
G03F1/22 |
代理机构 |
Haynes and Boone, LLP |
代理人 |
Haynes and Boone, LLP |
主权项 |
1. A semiconductor fabrication apparatus, comprising:
a lithography mask having a plurality of patterns, wherein at least two of the plurality of patterns are oriented in different directions, and wherein orientations of the at least two patterns are a function of their locations over the mask. |
地址 |
Hsin-Chu TW |