| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide solder paste that improves the visibility of a part reinforced with an adhesive agent in a joining part, thereby facilitating detection of failures. <P>SOLUTION: The solder paste 1 containing an adhesive agent includes: a solder containing 15-65 wt.% Bi and Sn; a resin for an adhesive agent, which is an epoxy resin; a curative agent; and a first activator that is a hydroxycarboxylic acid and a second activator that is an aliphatic dicarboxylic acid, thereby improving the visibility of a part reinforced with an adhesive agent in a joining part and facilitating detection of failures. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
