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发明名称
半導体装置パッケージ
摘要
申请公布号
JP5757979(B2)
申请公布日期
2015.08.05
申请号
JP20130154937
申请日期
2013.07.25
申请人
发明人
分类号
H01L23/50;H01L23/28
主分类号
H01L23/50
代理机构
代理人
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