| 摘要 |
<p>A UV curable composition suitable for use as an encapsulant to protect silicon semiconductor dies and their electrical bonding on digital print heads comprises an acrylate and/or methacrylate ((meth)acrylate) oligomer, preferably a difunctional oligomer; a diluent, preferably a (meth)acrylate; a tri-functional or tetra-functional thiol; a polypropylene oxide/butylene oxide block polymer; and a photoinitiator.</p> |
