发明名称 |
High Voltage Diode |
摘要 |
A trench-isolated RESURF diode structure (100) is provided which includes a substrate (150) in which is formed anode (130, 132) and cathode (131) contact regions separated from one another by a shallow trench isolation region (114, 115), along with a non-uniform cathode region (104) and peripheral anode regions (106, 107) which define vertical and horizontal p-n junctions under the anode contact regions (130, 132), including a horizontal cathode/anode junction that is shielded by the heavily doped anode contact region (132). |
申请公布号 |
US2015228713(A1) |
申请公布日期 |
2015.08.13 |
申请号 |
US201514697195 |
申请日期 |
2015.04.27 |
申请人 |
Lin Xin;Yang Hongning;Zuo Jiang-Kai |
发明人 |
Lin Xin;Yang Hongning;Zuo Jiang-Kai |
分类号 |
H01L29/06;H01L29/861;H01L27/12 |
主分类号 |
H01L29/06 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor diode device, comprising:
a semiconductor substrate region; an isolation structure for electrically isolating the semiconductor substrate region; a heavily doped first terminal contact region of a first conductivity type formed in the semiconductor substrate region; a heavily doped second terminal contact region of a second conductivity type located in the semiconductor substrate region to be spaced apart from the heavily doped first terminal contact region; a first terminal well region of the first conductivity type located in the semiconductor substrate region and under a first portion of the heavily doped first terminal contact region; and a second terminal well region of the second conductivity type located in the semiconductor substrate region comprising a deep portion located around the heavily doped second terminal contact region and a shallow portion that extends from the deep portion to the first terminal well region, where a peripheral portion of the shallow portion is located under a second portion of the heavily doped first terminal contact region. |
地址 |
Phoenix AZ US |