SEMICONDUCTOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME

摘要

A semiconductor packaging structure and a manufacturing method for the same are disclosed. The semiconductor packaging structure includes a chip, a dielectric layer and a plurality of redistribution circuit layers. The chip has a plurality of connection pads. The dielectric layer is disposed on the chip and defined with a plurality of containers therein. The connection pads are exposed from the containers, respectively. The redistribution circuit layers are disposed within the containers and electrically connected with the connection pads, respectively. Via these arrangements, the bonding surfaces between the redistribution circuit layers and the dielectric layer can be increased.

主权项

1. A method for manufacturing a semiconductor packaging structure, the method comprising steps of:
providing a chip which has a plurality of connection pads; providing a dielectric layer on the chip, wherein the dielectric layer covers the connection pads; removing parts of the dielectric layer to form a plurality of containers in the dielectric layer, wherein the connection pads are exposed from the containers respectively; and forming a plurality of redistribution circuit layers within the containers and electrically connecting the redistribution circuit layers with the connection pads respectively.