SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A semiconductor package including a chip stack structure having first and second chips that are secured to a dissipating plate by using a mold layer such that the second chip is combined to the dissipating plate and the first chip is bonded to the second chip, and the first chip has a smaller thickness than the second chip, a circuit board onto which the chip stack structure is mounted in a bonded manner, and an under-fill layer filling a gap space between the circuit board and first chip, a side surface of the under-fill layer being connected to a sidewall of the mold layer may be provided. Due to this bulk mounting structure, the warpage and bonding failures of the semiconductor package may be substantially reduced.

主权项

1. A semiconductor package comprising:
a chip stack structure having first and second integrated circuit chips that are secured to a thermal conductive plate using a mold layer such that the second integrated circuit chip is combined to the thermal conducive plate, the first integrated circuit chip is bonded to the second integrated circuit chip, and the first integrated circuit chip has a smaller thickness than the second integrated circuit chip; a circuit board onto which the chip stack structure is mounted in a bonded manner; and an under-fill layer filling a gap space between the circuit board and the first integrated circuit chip, a side surface of the under-fill layer connected to a sidewall of the mold layer.