SUBSTRATES WITH THROUGH VIAS WITH CONDUCTIVE FEATURES FOR CONNECTION TO INTEGRATED CIRCUIT ELEMENTS, AND METHODS FOR FORMING THROUGH VIAS IN SUBSTRATES

摘要

A through via (144) contains a conductor (244, 276) passing through a substrate (140) for connection to an integrated circuit element. The through via consists of two segments (144.1, 144.2) formed from respective different sides (140.1, 140.2) of the substrate and meeting inside the substrate. Each segment is shorter than the entire via, so via formation is facilitated. The second segment is etched after deposition of an etch stop layer (214) into the first segment. Due to the etch stop layer, the first segment's depth does not have to be rigidly controlled. The conductor is formed by separate depositions of conductive material into the via from each side of the substrate. From each side, the conductor is deposited to a shallower depth than the via depth, so the deposition is facilitated. Other embodiments are also provided.

主权项

1. A structure comprising:
(1) a substrate having a first side and a second side opposite to the first side, the substrate comprising a first material; (2) a through via passing through the first material of the substrate between the first and second sides, the through via having a first segment and a second segment joining the first segment inside the substrate, the first segment extending from the first side to the second segment, the second segment extending from the first segment to the second side, the first segment having an end adjacent to the second segment, the second segment having an end adjacent to the first segment; wherein when viewed from the first side, said end of the first segment completely laterally surrounds said end of the second segment but is laterally spaced from said end of the second segment; (3) a conductive feature passing through the through via and forming at least a part of a conductive path provided for connection to a circuit element of an integrated circuit, the conductive feature passing adjacent to all of an entire sidewall surface of the first segment and adjacent to all of an entire sidewall surface of the second segment.