发明名称 |
METAL LAMINATED SUBSTRATE FOR USE AS AN OXIDE SUPERCONDUCTING WIRE MATERIAL, AND MANUFACTURING METHOD THEREFOR |
摘要 |
<p>Provided are a method of manufacturing a metal laminated substrate for an oxide superconducting wire and a metal laminated substrate for an oxide superconducting wire, where copper can have sharp biaxial texture and the formation of scratches and grooves on a surface of copper can be prevented. The method includes the steps of: removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300MPa to 1500MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.</p> |
申请公布号 |
IN632DEN2012(A) |
申请公布日期 |
2015.08.21 |
申请号 |
IN2012DE00632 |
申请日期 |
2012.01.23 |
申请人 |
TOYO KOHAN CO., LTD.;SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
HIRONAO OKAYAMA;TEPPEI KUROKAWA;KOUJI NANBU;YOSHIHIKO ISOBE;TAKASHI KOSHIRO;ARIKA KANEKO;HAJIME OTA;KOTARO OHKI;TAKASHI YAMAGUCHI;KAZUYA OHMATSU |
分类号 |
H01B13/00 |
主分类号 |
H01B13/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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