SUBSTRATE CUTTING APPARATUS AND METHOD FOR MANUFACTURING DISPLAY APPARATUS USING THE SAME

摘要

The present invention provides a substrate cutting apparatus and a method for manufacturing a display apparatus using the same to prevent poor cutting of substrates and to allow the accurate cutting of the substrates. The substrate cutting apparatus comprises: an integrated laser beam emitting part wherein an infrared wavelength laser beam emitting part and a short pulse laser beam emitting part are adjacently fixated; a stage to allow a substrate to be placed; and a transfer part which transfers at least one among the laser beam emitting part and the stage to emit a short pulse laser beam right after the emission of an infrared wavelength laser beam to an area where the infrared wavelength laser beam is emitted from the laser beam emitting part.