| 发明名称 | Integrated circuit die stack | ||
| 摘要 | An integrated circuit die stack comprises a first die coupled with a second die. The first die has a first memory volume. The second die has a second memory volume different from the first memory volume. Each of the first and second dies comprises a functional circuitry and a programmable array coupled with the functional circuitry. The programmable arrays in the first and second dies are programmed to bypass one of the first die or the second die having the smaller of the first memory volume or the second memory volume at a first time period. | ||
| 申请公布号 | US9134959(B2) | 申请公布日期 | 2015.09.15 |
| 申请号 | US201414549236 | 申请日期 | 2014.11.20 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 发明人 | Chi Shyh-An |
| 分类号 | H03K19/177;H03K19/173;G06F7/72;H01L25/065;H03K19/0175 | 主分类号 | H03K19/177 |
| 代理机构 | Lowe Hauptman & Ham, LLP | 代理人 | Lowe Hauptman & Ham, LLP |
| 主权项 | 1. An integrated circuit die stack, comprising: a first die coupled with a second die, the first die having a first memory volume, the second die having a second memory volume different from the first memory volume, and each of the first and second dies comprising: a functional circuitry; anda programmable array coupled with the functional circuitry, wherein the programmable arrays in the first and second dies are programmed to bypass one of the first die or the second die having the smaller of the first memory volume or the second memory volume at a first time period. | ||
| 地址 | TW | ||