| 摘要 |
A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member. |
