| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves excellent heat dissipation performance and excellent lifetime by controlling strike-slip of an insulating substrate and a thickness of a bonding material.SOLUTION: A semiconductor device comprises: a heat dissipation member where a plurality of recesses are formed; an insulating substrate which has a first conductive plate bonded to a first principal surface and a second conductive plate bonded to a second principal surface and in which the heat dissipation member is fixed to the first conductive plate by using a first bonding material; a semiconductor chip fixed to the second conductive plate of the insulating substrate by using a second bonding material; and a resin member for encapsulating the insulating substrate and the semiconductor chip. The first conductive plate has a main salient and a plurality of auxiliary salients. The plurality of auxiliary salients each of which has a height higher than that of the main salient and which are arranged around the main salient. The plurality of auxiliary salients are fit with the plurality of recesses. The first bonding material is sandwiched between the main salient and the heat dissipation member. |
