| 摘要 |
A cooling device includes a power module incorporating chips that generate heat and having chip arrangement in which a first chip having the largest amount of heat generation and second chips having the second largest amount of heat generation are not adjacent to each other and the first chip is adjacent to any two of third chips having the smallest amount of heat generation, a heat sink, to a base surface of which the power module is closely attached, and flat first and second anisotropic high heat conductors having a thermal conductivity higher than a main body disposed on the surface of the heat sink. The first and second anisotropic high heat conductors are separated into two and disposed under the first chip and under the second chips. |
