发明名称 ELECTRONIC COMPONENT, AND MOUNTING METHOD OF ELECTRONIC COMPONENT
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component capable of easily manufacturing with a low cost and being mounted to an electric circuit board without using an adhesive agent other than solder, and a mounting method of the electronic component.SOLUTION: An electronic component 1 includes: an electronic component main body 2; and a lead terminal 3 connected to the electronic component main body 2, having a hollow shape in a longitudinal direction, and having a slit-like opening 4 at the part of the hollow shape.</p>
申请公布号 JP2015185799(A) 申请公布日期 2015.10.22
申请号 JP20140063621 申请日期 2014.03.26
申请人 NEC CORP 发明人 OTA HIROTOKU
分类号 H05K1/18;H01G2/06;H01G4/228;H01G9/004;H01L23/50;H05K3/34 主分类号 H05K1/18
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