| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a lead pin with simple structure that can be formed with good mass productivity, without requiring any special processing on the printed wiring board side, and capable of reducing occurrence of blow hole by enhancing solder wicking when soldering.SOLUTION: A lead pin 1 including a medium brim 20 around a prismatic substrate 10 is configured to form a recess 22 in the thickness direction of the medium brim 20, in the direction of the substrate 10 from the outer periphery of the medium brim 20.</p> |
