发明名称 ELECTRONIC COMPONENT CONVEYANCE DEVICE AND ELECTRONIC COMPONENT INSPECTION DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic component conveyance device and an electronic component inspection device which can separate electronic components conveyed ahead and behind from each other, while decreasing damages on the electronic components during conveyance.SOLUTION: An inspection device 1 includes: a conveyance lane 31 tilted with respect to a base plane 111, on which a plurality of IC devices 9 passes; and a separating mechanism 32 for separating an IC device 9A of the plurality of IC devices 9 passing on the conveyance lane 31 from an IC device 9B located behind the IC device 9A. The conveyance lane 31 is tilted relative to the horizon, and the IC devices 9 spontaneously slide on the conveyance lane 31.</p>
申请公布号 JP2015184162(A) 申请公布日期 2015.10.22
申请号 JP20140061561 申请日期 2014.03.25
申请人 SEIKO EPSON CORP 发明人 TERAJIMA SEIJI;MIYAMOTO HARUHIKO
分类号 G01R31/26;B65G47/08 主分类号 G01R31/26
代理机构 代理人
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