| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact power semiconductor device in which a load connection element is surely electrically insulated from the base body of the power semiconductor device and the housing is surely sealed from the base body.SOLUTION: A power semiconductor device has a first housing portion which has an electrically conductive load connection element and is integrally formed to extend laterally around a power semiconductor component 23. A metal base body 3 extends laterally around the power semiconductor component, is integrally formed and structured to have an elastic non-conductivity regionally at least partially, and has a first principal outer surface covered by a first sealing element extending laterally around the power semiconductor component. A part of the first sealing element is disposed between the first housing portion and the first principal outer surface of the base body. The first housing portion and the first principal outer surface of the base body are arranged to be pressed against the first sealing element. The first sealing element seals the first housing portion from the first principal outer surface of the base body. |
