CHEMICAL MECHANICAL POLISHING PAD WITH CLEAR ENDPOINT DETECTION WINDOW

摘要

Provided is a chemical mechanical polishing pad containing a polishing layer having a polishing surface, and an endpoint detection window. The endpoint detection window comprises an isocyanate terminated urethane prepolymer which is a reaction product of ingredients including an aliphatic polyfunctional isocyanate and a prepolymer polyol, having 5.5 to 9.5 wt% of unreacted NCO groups; and a curative system comprising 0 to 99 wt% of a difunctional curative and 1 to 100 wt% of an amine initiated polyol curative having at least one nitrogen atom per molecule and an average of at least three hydroxyl groups per molecule. Also, provide are methods for manufacturing and using the chemical mechanical polishing pad.