发明名称 FILM DEPOSITION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a film deposition apparatus for depositing a metal melted on a resin film without being damaged.SOLUTION: An apparatus for depositing a metal melted on a resin film 24 is provided with a melting part 11 for melting the metal, a pressure application part 13 for pushing out the molten metal, a nozzle 14 for discharging the molten metal from the melting part 11, a dispersion gas blowout part 15 for blowing out dispersion gas for dispersing the molten metal discharged from the nozzle, and a heat insulation part 31 between the nozzle and the dispersion gas blowout part.
申请公布号 JP2015199986(A) 申请公布日期 2015.11.12
申请号 JP20140079473 申请日期 2014.04.08
申请人 PANASONIC IP MANAGEMENT CORP 发明人 HAYATA HIROSHI
分类号 C23C4/14;B05B7/06;H01M4/139 主分类号 C23C4/14
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