发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an art of enabling reduction in chip size of a semiconductor chip; and especially provide an art of enabling reduction in chip size of a semiconductor chip by shaping a layout arrangement in a short side direction in a rectangular-shaped semiconductor chip which composes an LCD driver.SOLUTION: A semiconductor chip CHP2 which composes an LCD driver comprises: input protective circuits 3a-3c arranged in a lower layer of part of a plurality of input bump electrodes IBMP; and SRAMs 2a-2c (internal circuits) arranged in the lower layer of the rest part of the plurality of input bump electrodes IBMP, where the input protective circuits 3a-3c are not arranged.
申请公布号 JP2015201664(A) 申请公布日期 2015.11.12
申请号 JP20150127219 申请日期 2015.06.25
申请人 RENESAS ELECTRONICS CORP 发明人 SUZUKI SHINYA;MAKUTA KIICHI
分类号 H01L21/822;H01L21/60;H01L21/82;H01L27/04;H01L27/06 主分类号 H01L21/822
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