| 摘要 |
PROBLEM TO BE SOLVED: To provide a flow soldering device capable of effectively removing a solder joint and an oxide of a molten solder and preventing oxidation without using a conventional flux.SOLUTION: The flow soldering device includes: a solder bath 37 in which a molten solder 39 is accommodated; a solder nozzle 47 for jetting the molten solder out of a jet-flow port; and solder feeding means for press-feeding the molten solder in the solder bath to the solder nozzle. The flow soldering device also includes: a cylindrical outer nozzle 49 which is disposed in an outer periphery of the cylindrical solder nozzle while being spaced therefrom and forms a circulation path 50 with an annular cross section; and gas supply means for supplying a reducing gas or a mixture gas of the reducing gas and an inert gas to the circulation path. The circulation path 50 is opposite to the inside of the solder bath 37 while opening the distal end thereof and opening the proximal end thereof. It is preferable to include a reduction unit 8 which brings the reducing gas or the mixture gas of the reducing gas and the inert gas into contact with the solder joint prior to soldering. |
