| 摘要 |
<p>Provided is a device for packaging an electronic component, having a variable nozzle pitch mechanism that does not use an air hose. The present invention has a first nozzle unit (36) supported on a mounting head (33) and provided so as to be capable of raising and lowering suction chucking nozzles (34A, 34B) for suction chucking an electronic component, a second nozzle unit (37) supported on the mounting head so as to be able to vary the nozzle pitch with respect to the first nozzle unit and provided so as to be able to raise and lower suction chucking nozzles (36A, 36B) for suction chucking the electronic component, a nozzle pitch varying means (80, 83) for moving the second nozzle unit relative to the first nozzle unit and changing the nozzle pitch, and an air channeling means (90) for channeling air between the mounting head or first nozzle unit and the second nozzle unit, the air channeling means being retained on one of the mounting head or first nozzle unit and the second nozzle unit and being provided with air ducts (93A, 93B) fitted in the other of the mounting head or first nozzle unit and the second nozzle unit so as to be able to slide relative thereto.</p> |
