| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor device capable of manufacturing a semiconductor device having high connection reliability by successfully performing electric connection between a semiconductor element and an adherend when the semiconductor element is mounted. <P>SOLUTION: A manufacturing method for a semiconductor device includes the steps of: preparing a sealing sheet provided with an underfill material; sticking a connection member formation surface of a semiconductor wafer to the sealing sheet; forming the semiconductor element by dicing the semiconductor wafer; and electrically connecting the semiconductor element and the adherend via the connection member while filling the space between the adherend and the semiconductor element with the underfill material. The step of electrically connecting the semiconductor element and the adherend includes the steps of: bringing the connection member into contact with the adherend under a temperatureαsatsifying the following condition (1); and fixing the connection member brought into contact with the adherend to the adherend under a temperatureβsatisfying the following condition (2): Condition (1): Melting point of connection member -100°C≤α<melting point of connection member Condition (2): Melting point of connection member≤β≤melting point of connection member +100°C. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
