PRINTED-CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a printed-circuit board in which a fine circuit is made to be easily produced by controlling the conductor thickness of a surface layer of the printed-circuit board, and to provide a manufacturing method thereof.SOLUTION: A printed-circuit board comprises: a laminate 5 including an insulating plate 1, a wiring pattern 2 formed on both surfaces of the insulating plate 1, an insulation resin layer 3 laminated on the surface of the insulating plate 1 having the wiring pattern 2 formed thereon; and a conductive metal foil 4 attached to the insulation resin layer 3; a through hole 10 that penetrates the laminate 5; and conductor layers 7 and 7' that are formed on the surface of the conductive metal foil 4 of the laminate and the inner surface of the through hole 10, and form a surface layer together with the conductive metal foil 4. Density circuit formation on the surface layer is realized by controlling the thickness of the conductor layer 7 formed on the surface of the laminate.