Solid-state imaging element and electronic apparatus

摘要

A method of manufacturing a solid-state imaging element includes: manufacturing an element chip in which photoelectric conversion units are arranged on a main surface side; preparing a base configured using a material with an expansion coefficient greater than the element chip and having an opening of which the periphery of the opening is shaped as a flat surface; expanding the base by heating, mounting the element chip on the flat surface of the base in a state where the opening of the base is covered; and three-dimensionally curving a portion corresponding to the opening in the element chip by cooling and contracting the base in a state where the element chip is fixed to the flat surface of the expanded base.

主权项

1. A solid-state imaging element comprising:
an element chip having a curved portion curved three-dimensionally and a flat portion extended from a peripheral edge of the curved portion; photoelectric conversion units arranged on a concave surface side of the curved portion in the element chip; and a base configured using a material with au expansion coefficient greater than an expansion coefficient of the element chip, and having an opening in which a periphery of the opening is shaped as a flat surface, wherein in a state where the curved portion of the element chip is inserted in the opening of the base, the flat portion of the element chip is fixed to the flat surface of the base.